Lenovo 4XG7A37935, Intel Xeon Silver Processor, LGA 3647 (Socket P), 14 nm, 2.1 GHz, 64-bit, Server/workstation Component
Description
LenDCG-4XG7A37935
Lenovo DCG ThinkSystem SR550/SR590/SR650 Intel Xeon Silver 4208 8C 85W 2.1GHz Processor Option Kit w/o FAN
Lenovo 4XG7A37935. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX-512, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650
Features
Processor
Processor cores | 8 |
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Processor threads | 16 |
Processor operating modes | 64-bit |
Processor lithography | 14 |
Processor cache type | Smart Cache |
Processor frequency | 2.1 |
Processor family | Intel Xeon Silver |
Processor socket | LGA 3647 |
Component for | Server/Workstation |
Processor model | 4208 |
Processor cache | 11 |
Processor boost frequency | 3.2 |
Processor codename | Cascade Lake |
Bus type | UPI |
Thermal Design Power (TDP) | 85 |
Processor series | Intel Xeon Silver 4000 Series |
Processor socket | LGA 3647 (Socket P) |
Processor base frequency | 2.1 |
Memory
Memory types supported by processor | DDR4-SDRAM |
---|---|
Memory clock speeds supported by processor | 2400 |
ECC | Y |
Memory channels | Hexa-channel |
Maximum internal memory supported by processor | 1000 |
Graphics
On-board graphics adapter | N |
---|---|
Discrete graphics adapter | N |
On-board graphics adapter model | Not available |
Discrete graphics adapter model | Not available |
Power
Thermal Design Power (TDP) | 85 |
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Features
PCI Express slots version | 3.0 |
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Execute Disable Bit | Y |
Maximum number of PCI Express lanes | 48 |
Supported instruction sets | AVX-512 |
Scalability | 2S |
Embedded options available | N |
Operational conditions
Tcase | 78 |
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Processor special features
Intel Hyper Threading Technology (Intel HT Technology) | Y |
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Intel Turbo Boost Technology | 2.0 |
Intel AES New Instructions (Intel AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Trusted Execution Technology | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel 64 | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
Intel vPro Platform Eligibility | Y |
Intel TSX-NI | Y |
Intel Speed Shift Technology | Y |
Intel Turbo Boost Max Technology 3.0 | N |
Weight & dimensions
Processor package size | 76 x 56.5 |
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Other features
Compatibility | ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650 |
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Inventory Last Updated: Nov 20, 2024